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Vacuum mount Product List

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Film Attachment Device | Vacuum Mounter TV-150/200/300

Film Attachment Device | Vacuum Mounter TV-150/200/300

A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.

The "TV-150/TV-200/TV-300" is a standard type of vacuum mount that attaches wafers to dicing tape in a vacuum environment. By performing the attachment process inside a vacuum chamber, it suppresses the retention of air bubbles, which can be problematic in atmospheric attachment, and achieves uniform and highly reproducible attachment quality across the entire wafer surface. It is a compact, versatile model that can accommodate a wide range of processes. TV-150: 150mm (6 inches) TV-200: 200mm (8 inches) TV-300: 300mm (12 inches)

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter
  • Vacuum mount

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Film Attachment Device | Vacuum Mounter TV-200T

Film Attachment Device | Vacuum Mounter TV-200T

TAIKO(R) wafer and thin wafer compatible models

The "TV-200T" is a vacuum mount designed to accommodate wafers with step or special shapes on the outer edge, such as TAIKO(R) wafers and thin wafers. By adopting a bonding method using a top membrane, it achieves "radial bonding," which uniformly applies tape from the center of the wafer outward. This helps to suppress stress concentration and uneven bonding on the outer edge specific to TAIKO(R) wafers, providing stable mounting quality. 【Compatible Wafer Size】 TV-200T: 200mm (8 inches) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter
  • Vacuum mount

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Film Attachment Device | Vacuum Mounter TV-200H / 300H

Film Attachment Device | Vacuum Mounter TV-200H / 300H

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

The "TV-200H/TV-300H" is a heated vacuum mount that combines a vacuum adhesion method with a heating function. By heating the adhesion stage, it stabilizes the properties of the adhesive tape, and through the synergistic effect with vacuum adhesion, it achieves a more uniform and reproducible mounting quality. This model is suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized. 【Supported Wafer Sizes】 TV-200H: 200mm (8 inches) TV-300H: 300mm (12 inches)

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter
  • Vacuum mount

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Film Attachment Device | Vacuum Mounter TV-200TH

Film Attachment Device | Vacuum Mounter TV-200TH

A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

The "TV-200TH" is a vacuum mount that combines a membrane bonding method compatible with TAIKO(R) wafers and a heating function. By applying radial bonding in a vacuum environment, it suppresses stress concentration on the unique outer edge steps and thin sections of TAIKO(R) wafers, and by stabilizing the properties of the adhesive tape with a heated chuck, it achieves high bonding uniformity and reproducibility. This is the top model designed for processes with high difficulty, such as thin wafers and high-value-added devices. 【Compatible wafer size】 TV-200TH: 200mm (8 inches) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter
  • Vacuum mount

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